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| PR IM EL Y AR IN CTLSH05-40M621 Central DESCRIPTION: TM SURFACE MOUNT LOW VF SILICON SCHOTTKY DIODE Semiconductor Corp. Top View Bottom View TLM621 CASE MARKING CODE: CH APPLICATIONS: * * * * DC/DC Converters Voltage Clamping Protection Circuits Battery Powered Portable Equipment The CENTRAL SEMICONDUCTOR CTLSH05-40M621 Low VF Schottky Diode packaged in a TLMTM (Tiny Leadless ModuleTM), is a high quality Schottky Diode designed for applications where small size and operational effciency are the prime requirements. With a maximum power dissipation of 0.9W, and a very small package footprint (comparable to the SOT-563), this leadless package design is capable of dissipating over 3 times the power of similar devices in comparable sized surface mount packages. * Very Small Package Size * Current (IF=0.5A) * Low Forward Voltage Drop (VF=0.47V MAX @ 0.5A) FEATURES: * High Thermal Efficiency * Small TLM 2x1mm case MAXIMUM RATINGS: (TA=25C) Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current, tp 1ms Forward Surge Current, tp = 8ms Power Dissipation SYMBOL Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL CHARACTERISTICS: SYMBOL IR IR BVR VF VF VF VF VF CT TEST CONDITIONS VR= 10V VR= 30V IR= 500A IF= 100A IF= 1.0mA IF= 10mA IF= 100mA IF= 500mA VR=1.0V, f=1.0MHz P E R I L IN M VRRM IF IFRM IFSM PD TJ, Tstg JA Y R A 40 500 3.5 10 0.9 -65 to +150 139 MIN MAX 20 100 40 0.13 0.21 0.27 0.35 0.47 50 UNITS V mA A A W* C C/W* (TA=25C unless otherwise noted) UNITS A A V V V V V V pF *FR-4 Epoxy PCB with copper mounting pad area of 33mm2 R1 (27-April 2006) Central TM Semiconductor Corp. P L RE IM RY NA ICTLSH05-40M621 SURFACE MOUNT LOW VF SILICON SCHOTTKY DIODE TLM621 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) For standard mounting see TLM621 Package Details LEAD CODE: 1) 2) 3) 4) 5) 6) CATHODE CATHODE ANODE ANODE CATHODE CATHODE MARKING CODE: CH R1 (27-April 2006) |
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